APPLYING THERMOELECTRIC COOLING MODULE FOR SMALL MOTORIZED SPINDLE
Overheat in small motorized spindle may causes suddenly damage during operation. Spindle is usually cooled by air or water to keep its temperature lower a critical value. In this paper, a cooling system based on Thermoelectric Cooling Module (TCM) is developed and applied to control the spindle temperature. An algorithm related Proportional Integral Derivative (PID) is used to control input power for TCM resulting on heating or cooling modes. Effect of PID coefficients on stability of temperature is analysed and two control units (PD) are chosen for controlling temperature on the spindle. Results show that energy consumption of TCM system is much less than that of the air cooling system. Thermal deformation under TCM is also reduced significantly comparing to conventional air cooling system. Therefore, it can conclude that TCM has high efficiency to cooling the small motorized spindle.
B. Bediz, B. A. Gozen, E. Korkmaz, and O. B. Ozdoganlar, “Dynamics of ultra-high-speed (UHS) spindles used for micromachining,” International Journal of Machine Tools and Manufacture, vol. 87, pp. 27-38, 2014.
E. Creighton, A. Honegger, A. Tulsian, and D. Mukhopadhyay, “Analysis of thermal errors in a high-speed micro-milling spindle,” International Journal of Machine Tools and Manufacture, vol. 50, pp. 386-393, 2010.
S. Gao, K. Cheng, H. Ding, and H. Fu, “Multiphysics-based design and analysis of the high-speed aerostatic spindle with application to micro-milling,” Proceedings of the Institution of Mechanical Engineers, Part J: Journal of Engineering Tribology, vol. 230, pp. 852-871, 2016.
S. Jiang and S. Lin, “A technical note: an ultra-high-speed motorized spindle for internal grinding of small-deep hole,” The International Journal of Advanced Manufacturing Technology, vol. 97, pp. 1457-1463, 2018.
B. Knapp, D. Arneson, D. Oss, M. Liebers, R. Vallance, and E. R. Marsh, “Ultra-precision, high speed micro-machining spindle,” in 11th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2011, 2011, pp. 267-270.
Y. Cai, Y. Wang, D. Liu, and F.-Y. Zhao, “Thermoelectric cooling technology applied in the field of electronic devices: Updated review on the parametric investigations and model developments,” Applied Thermal Engineering, vol. 148, pp. 238-255, 2019.
P. Fredes, U. Raff, E. Gramsch, J. Pascal, and J. Cuenca, “Junction temperature control of UV-C LEDs based on a thermoelectric cooler device,” Microelectronics Reliability, vol. 98, pp. 24-30, 2019.
K. J. Åström, T. Hägglund, C. C. Hang, and W. K. Ho, “Automatic tuning and adaptation for PID controllers-a survey,” Control Engineering Practice, vol. 1, pp. 699-714, 1993.
Y. Li, K. H. Ang, and G. C. Chong, “Patents, software, and hardware for PID control: an overview and analysis of the current art,” IEEE Control Systems Magazine, vol. 26, pp. 42-54, 2006.
J. G. Ziegler and N. B. Nichols, “Optimum settings for automatic controllers,” trans. ASME, vol. 64, 1942.
J. Mayr, J. Jedrzejewski, E. Uhlmann, M. A. Donmez, W. Knapp, F. Härtig, et al., “Thermal issues in machine tools,” CIRP annals, vol. 61, pp. 771-791, 2012.