EFFECTS OF INDENTER RADIUS ON MECHANICAL PROPERTIES AND DEFORMATION BEHAVIOR OF Cu50Zr50 METALLIC GLASSES IN INDENTATION AND SCRATCHING PROCESS
Abstract
In this paper, a combination between the indentation and scratching process was developed to analyze the deformation mechanisms and mechanical properties of Cu50Zr50 metallic glasses (MGs) using molecular dynamics (MD) simulation. The deformation mechanisms and mechanical properties of Cu50Zr50 MGs are appraised through the surface morphology, pile-up height, hardness, machining forces, and resistance coefficient. The influences of different indenter radius are clearly investigated. The results exhibit that the machining zone increases as increasing indenter radius. The pile-up height and hardness reduce with a bigger radius of the indenter. The hardness values range from 7.94 to 13.33 GPa. The forces increase, however, the resistance coefficient decreases as the indenter radius increases.
References
Wright, W. J., Liu, Y., Gu, X., Van Ness, K. D., Robare, S. L., Liu, X., ... &Dahmen, K. A. (2016). Experimental evidence for both progressive and simultaneous shear during quasistatic compression of a bulk metallic glass. Journal of Applied Physics, 119(8), 084908.
Liu, Z. Y., Wang, G., Chan, K. C., Ren, J. L., Huang, Y. J., Bian, X. L., ... &Zhai, Q. J. (2013). Temperature dependent dynamics transition of intermittent plastic flow in a metallic glass. I. Experimental investigations. Journal of Applied Physics, 114(3), 033520.
Hilzinger, H. (1985). Applications of metallic glasses in the electronics industry. IEEE Transactions on Magnetics, 21(5), 2020-2025.
Bailey, N. P., Schiøtz, J., & Jacobsen, K. W. (2004). Simulation of Cu-Mg metallic glass: Thermodynamics and structure. Physical Review B, 69(14), 144205.
Wang, Y., Zhang, J., Wu, K., Liu, G., Kiener, D., & Sun, J. (2018). Nanoindentation creep behavior of Cu–Zr metallic glass films. Materials Research Letters, 6(1), 22-28
Bhatia, M. A., Rajagopalan, M., Darling, K. A., Tschopp, M. A., & Solanki, K. N. (2017). The role of Ta on twinnability in nanocrystalline Cu–Ta alloys. Materials Research Letters, 5(1), 48-54.
Kazanc, S. (2007). Molecular dynamics study of pressure effect on crystallization behaviour of amorphous CuNi alloy during isothermal annealing. Physics Letters A, 365(5-6), 473-477.
Ye, Y., Yang, X., Wang, J., Zhang, X., Zhang, Z., & Sakai, T. (2014). Enhanced strength and electrical conductivity of Cu–Zr–B alloy by double deformation–aging process. Journal of Alloys and Compounds, 615, 249-254.
Zhu, P. Z., Hu, Y. Z., Wang, H., & Ma, T. B. (2011). Study of effect of indenter shape in nanometric scratching process using molecular dynamics. Materials Science and Engineering: A, 528(13-14), 4522-4527.
AlMotasem, A. T., Bergström, J., Gåård, A., Krakhmalev, P., & Holleboom, L. J. (2017). Atomistic insights on the wear/friction behavior of nanocrystalline ferrite during nanoscratching as revealed by molecular dynamics. Tribology letters, 65(3), 101.