SILE PROPERTIES OF MONOCRYSTALLINE GOLD FILM USING MOLECULAR DYNAMICS SIMULATION
In this paper, the tensile properties of the monocrystalline gold film are studied by using molecular dynamics simulation. The stress-strain relation, crack growth behavior and effects of different temperature are considered. The results show that the stress concentration is obviously distributed in the middle and corners of the specimen, leading to the cracks are formed and propagated in these positions. Under the tensile process, the transformation from the face-centered cubic (FCC) into hexagonal closest packed (HCP) structures occurred. From the stress-strain diagram, the tensile strength and Young’s modulus values decreased with increasing temperature. The RDF is decreased with a higher temperature.
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